Glue Laser Cleaning

Glue removal software automatically adapt to matching circuit, high-resolution CCD for automatic positioning;
No-contacting positioning processing for no pollution, no damage to materials;
Lower operating cost, convenient maintenance, no consumables, automatic operation, saving time and effort;
Stable performance on CCD chip’s glue cleaning (micron accuracy), no damage on substrate;
Adopts coaxial vision positioning technology, visual programming help to achieve WYSIWYG processing method;
Mirror stainless steel cover, efficient fume filtering system, work properly in dust-free workshop;
Built-in smoke and dust purifier to collect smoke and dust during work to achieve zero pollution and zero emission;
Automatic loading and unloading system, less labor cost.

Specification

Model	LCD200-A
Laser type	Infrared laser
Working area(mm)	100×100
Graphic format supported	PLT，DXF
Working enviroment	10-35℃
Equipment power(Kw)	＜10
Laser processing accuracy(mm)	± 0.02
Supply voltage	220V/50Hz

Applied to chips, camera module, surface cleaning.

Feed quality inspection (IQC)

Perform strict inspection and inspection on all products and raw materials supplied by suppliers
Process Inspection (IPQC/PQC)

Strict quality control from the start of the production to the finished manufacturing process
Inbound inspection (FQC)

Before the finished product is put into storage, according to the inspection standard, the "production order" carries out comprehensive quality inspection and control.

Equipment quotation, industry custom models, laser process solutions, free proofing