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Professional laser cutting software for PCB industry, and easy for operation;The MES system customization and seamless docking of the production line can be realized; -
Imported laser source and optic system to ensure machine long term stable performance; -
CCD module helps to achieve auto-positioning cutting; -
Optional with linear motor and marble platform to achieve high precision requirement; -
Multiple platforms more functions,honeycomb adsorption platform is standard; -
PCB board transmission track is optional, and prefect match SMTassembly line; -
FPCB processing platform and is optional.
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Specification
| Model | MS0404-V-B |
| Laser power (W) | UV Laser:10~20 Green laser:30 |
| Work are (mm) | 400*400 |
| Spot size (μm) | ＜ 20 |
| Accuracy (μm) | ±20 |
| Dimension (mm) | 1300*1100*1750 |
| Power supply | AC220±10%，50/60HZ |
| Working environment | Temp:15~ 30°C,
Humidity:5~85% Clean,less dust, no condensation |
| Weight (KG) | 1200 |
| Total power (KG) | 6 |
Application
Laser cutting/dividing machine used in electronic industry can be used for fine cutting and dividing of hard board, soft board, covering film and other products.
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Quality Control
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Feed quality inspection (IQC)
Perform strict inspection and inspection on all products and raw materials supplied by suppliers -
Process Inspection (IPQC/PQC)
Strict quality control from the start of the production to the finished manufacturing process -
Inbound inspection (FQC)
Before the finished product is put into storage, according to the inspection standard, the "production order" carries out comprehensive quality inspection and control.
